首页> 外国专利> STABILITY ENHANCEMENT OF MOLTEN SOLDER DROPLETS AS EJECTED FROM A NOZZLE OF DROPLET PUMP

STABILITY ENHANCEMENT OF MOLTEN SOLDER DROPLETS AS EJECTED FROM A NOZZLE OF DROPLET PUMP

机译:从滴水泵的喷嘴喷出的熔锡液滴的稳定性增强

摘要

Apparatus for increasing the stability of molten solder droplets discharged from a drop pump, having a nozzle (9) and a jet (9) for discharging the individual molten solder droplets (9) connected to a soldering device for applying the molten solder (11) to a target surface a means (12) for discharging molten solder (11) into the opening (12). A method for increasing the stability of molten solder droplets discharged from a dropper pump, wherein a molten soldering fluid (11) is discharged from a nozzle (9) permitting individual molten solder droplets, more particularly to the outlet (12) and to the outlet (12). ŕ
机译:用于增加从滴泵排出的熔融焊料滴的稳定性的装置,该装置具有喷嘴(9)和用于排出各个熔融焊料滴(9)的射流(9),该喷嘴连接到用于施加熔融焊料(11)的焊接装置到目标表面的装置(12),用于将熔融焊料(11)排放到开口(12)中。一种用于提高从滴管泵排出的熔融焊锡滴的稳定性的方法,其中,从喷嘴(9)排出熔融的焊锡液(11),该喷嘴允许单个的熔融焊锡滴,更具体地讲,到达出口(12)和出口(12)。 ŕ

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