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PROCESS FOR FORMING FILM COVERED SHEET METAL MATERIAL AND SHEET METAL MATERIAL SO COVERED

机译:覆膜金属板的成型方法及覆膜金属板的成型方法

摘要

A plastic film (44) is bonded with an adhesive (48) to a sheet metal substrate (46). The sheet metal substrate is processed in a laser operation to form grooves, openings or cuts in the sheet metal. The laser operation has a pressurized gas stream that is directed to the laser beam cut to clean and cool the cut. The gas enters the film-substrate interface at the opening formed by the beam. The film has slits (50) or other perforations throughout so that as the pressurized gas impinges upon the film and its opening formed by the laser beam and enters the film-substrate interface, the adjacent slits bleed the pressurized gas from the film-substrate interface to prevent significant lifting of the film from the substrate into a bubble which otherwise interferes with and can stop the laser operation. The perforations may be in the form of weakened recesses (47) in the film which open in reponse to lifting of the film by gas pressure at the interface with the underlying metal sheet. The dimensions of the perforations are such that the sheet metal is protected during prior handling and the laser processing while maintaining the integrity of the film so it can be easily removed as a unit and not shared during such removal.
机译:塑料膜(44)通过粘合剂(48)粘合到金属板基板(46)上。在激光操作中对金属板基材进行处理,以在金属板上形成凹槽,开口或切口。激光操作的压缩气流被导向切割的激光束,以清洁和冷却切割。气体在由束形成的开口处进入膜-基底界面。薄膜各处具有缝隙(50)或其他穿孔,因此当加压气体撞击薄膜及其由激光束形成的开口并进入薄膜-基材界面时,相邻的缝隙会从薄膜-基材界面排出加压气体以防止将薄膜从基材上显着提升到气泡中,否则气泡会干扰并停止激光操作。穿孔的形式可以是薄膜中的弱化凹槽(47),其响应于在与下面的金属板的界面处的气压而提升薄膜而打开。穿孔的尺寸使得在先前的处理和激光处理期间保护金属板,同时保持膜的完整性,因此可以容易地将其作为一个单元整体移除,并且在这种移除过程中不共享。

著录项

  • 公开/公告号WO0141968A3

    专利类型

  • 公开/公告日2002-02-14

    原文格式PDF

  • 申请/专利权人 MAIN TAPE COMPANY INC.;

    申请/专利号WO2000US42043

  • 发明设计人 ELZAHR SIDNEY;MAHONEY DENNIS MICHAEL;

    申请日2000-11-10

  • 分类号B23K26/18;B23K26/14;C09J7/02;

  • 国家 WO

  • 入库时间 2022-08-22 00:38:30

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