A SEMICONDUCTOR DEVICE INCLUDING AN INTEGRATED CIRCUIT HOUSED IN AN ARRAY PACKAGE HAVING SIGNAL TERMINALS ARRANGED ABOUT CENTRALLY LOCATED POWER SUPPLY TERMINALS

摘要

A semiconductor device package, and a semiconductor device (30) employing the package, are described. The semiconductor device package is intended for housing an integrated circuit (IC), and includes a substrate (32) adapted to received the IC. The substrate (32) includes a surface (e.g., an underside surface) having an outer portion surrounding a center portion. A first group of signal terminals (34) are arranged about the outer portion of the surface, and a second group of power supply terminals (36A-36D) are arranged about the center portion. Placing the power supply terminals in the center portion of the surface reduces the lengths of power supply current paths within the substrate, thus reducing IR voltage drops within the substrate. The power supply terminals are made physically larger than the signal terminals such that the electrical resistances of the power supply terminals are lower than the electrical resistances of the signal terminals.