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Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition
Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition
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机译:芳基酯化合物,其制造方法,使用该化合物的环氧树脂组合物以及使用该环氧树脂组合物的覆铜层压板
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摘要
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: CHEM with a carbonyl compound represented by the general formula: CHEM which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.
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