Kühler zur Kühlung eines Leistungshalbleiterbauelements bzw.-Moduls sowie Verfahren zum Herstellen eines solchen Kühlers

摘要

Heat sink (22) comprises a porous ceramic foam body (11) in thermal contact with a power semiconductor component or module via a cooling surface (21). Water, as a cooling liquid, is allowed to pass through the body. An Independent claim is also included for a process for the production of a heat sink comprising inserting a ceramic foam body into a housing (20) consisting of an upper part (12) and a lower part (13), and joining the two parts. Preferred Features: The ceramic foam body is made from aluminum nitride. The ceramic foam body is produced by impregnating a foam body made from a polymeric foam with a ceramic slip, firing, and sintering the impregnated foam body.