- - Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions Improved wire-scribed boards interconnection cards and smart cards made by these methods

摘要

An apparatus and a method for forming a filament circuit pattern having a flat portion and an uneven portion and an interconnection card formed therefrom, a smart card or a light circuit card are provided. The path of the filament circuit is scribed by moving the filament guide and substrate relative to each other and distributing the filament on or near the surface of the substrate. The filament or substrate or both have an attachment surface. The adhesive surface can be activated by applying energy. Energy is applied simultaneously or after scribing. A part of the filament circuit pattern is flat and the other part is uneven. The non-flat portion traverses a predetermined region of the substrate, but does not contact or adhere thereto. The predetermined region corresponds to a pad, a contact pattern, a hole, an elongated groove, a protruding portion, a scribe flat portion before the pattern, and an end point of the filament. Alternatively, the non-flat portion may be inserted under the surface of the substrate. The other flat portion of the filament circuit traverses a predetermined portion of the previously scribed non-flat portion, but does not contact or adhere thereto. A wire-scribe board is formed by the above-described method including an interconnection card, a smart card or an optical fiber circuit card.