Residual Part Observation Device and Electronic Part Observation Method

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component observing apparatus and an electronic component observing method which are very suitable for observing a bumped electronic component, and an object thereof is to provide an electronic component observing apparatus and method capable of accurately recognizing a bumped electronic component. A reflection recognition light emitting unit 18 for irradiating light toward the arrangement surface of the bump 4 of the electronic component 1, a transmission recognition light emitting unit 19 for irradiating light to the background plate 7, and an electronic component. A bump recognition light emitting unit 20 for irradiating light at an acute angle with respect to the arrangement surface of the terminal of the Among the bump recognition light emitting parts, the light emitting parts to be turned on are used for switching.