首页> 外国专利> A method for applying a sensor - current loop to a conductor support, as well as an inductive sensor

A method for applying a sensor - current loop to a conductor support, as well as an inductive sensor

机译:一种将传感器-电流回路应用于导体支架的方法以及电感式传感器

摘要

An economically in series which can be manufactured and a rotor movable for a compact, incrementally be measured directly or inductive sensor is obtained if, by means of hot stamping from a thick foil, which in the heated printing block predetermined geometry of the induction current loop - directly to the - also non-flat - surface of a thermoplastic conductor support to be punched and in the same the course is welded to the same.
机译:如果借助于厚箔片的热冲压,在加热的印刷模块中感应电流回路的预定几何形状,则可以经济地串联生产,并且可以紧凑地,可直接测量增量式转子或直接测量电感式传感器-直接在要打孔的热塑性导体支架的-同样也是非平坦的表面上,并在同一过程中将其焊接到相同的表面上。

著录项

  • 公开/公告号DE19840665C2

    专利类型

  • 公开/公告日2002-08-14

    原文格式PDF

  • 申请/专利权人 OECHSLER AG 91522 ANSBACH DE;

    申请/专利号DE1998140665

  • 发明设计人

    申请日1998-09-05

  • 分类号H05K1/16;G01B7/30;G01D5/20;G01P3/48;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:54

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