Forming conducting coatings on substrate through hole walls involves applying covering coating on one side, coating with electrically conducting material, removing covering coating

摘要

The method involves coating the substrate (1) with a covering coating (6) on one side (5) so that the wall (9) of the through holes (2-4) at the ends (8) on this side of the substrate are coated with the material around their periphery, coating the substrate with an electrically conducting material and removing the covering coating.