Casting composition for removing thermal energy from electrical or electronic device, comprises epoxide resin, silicone, filler and initiator and cures by chemical reaction, has specified thermal conductivity

摘要

Casting composition based on a resin curing by a chemical reaction, which contains an epoxide resin component (I), a silicone-containing component (II), a filler (III) and an initiator (IV), has a thermal conductivity of - 2 W/mK.