首页> 外国专利> Selective laser sintering of a powder used as a rapid prototyping process comprises adding the powder to an encapsulated chamber, and forming a powder cake

Selective laser sintering of a powder used as a rapid prototyping process comprises adding the powder to an encapsulated chamber, and forming a powder cake

机译:用作快速原型制作过程的粉末的选择性激光烧结包括将粉末添加到密封室中,并形成粉末饼

摘要

Process for selective laser sintering of a powder comprises adding the powder to an encapsulated chamber, and forming a powder cake. The encapsulation is heated so that a temperature distribution is adjusted in the encapsulation. The temperature decreases from the regions of the encapsulation which border the sintered surface of the cake in the direction of the base of the chamber. An Independent claim is also included for a device for selective laser sintering of a powder. Preferred Features: The temperature decreases in a linear manner. The encapsulation comprises a heater which is controlled in such a way that the temperature of the chamber base corresponds to each point of the temperature of the region of the chamber wall.
机译:用于粉末的选择性激光烧结的方法包括将粉末添加到封装的腔室中,并形成粉末饼。加热封装,使得在封装中调节温度分布。温度从包封物的区域降低,该区域在腔室底部的方向上与饼的烧结表面接壤。还包括用于粉末的选择性激光烧结的装置的独立权利要求。优选特征:温度以线性方式降低。封装包括加热器,该加热器被控制为使得腔室底部的温度对应于腔室壁的区域的温度的每个点。

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