首页> 外国专利> Production of a process gas used for treating semiconductor substrates comprises burning oxygen in a hydrogen-rich atmosphere in a combustion chamber to form a gas made from water vapor and hydrogen

Production of a process gas used for treating semiconductor substrates comprises burning oxygen in a hydrogen-rich atmosphere in a combustion chamber to form a gas made from water vapor and hydrogen

机译:用于处理半导体衬底的工艺气体的生产包括在燃烧室中的富氢气氛中燃烧氧气以形成由水蒸气和氢气制成的气体

摘要

Production of a process gas comprises burning oxygen in a hydrogen-rich atmosphere in a combustion chamber to form a gas made from water vapor and hydrogen. An Independent claim is also included for a device for producing a process gas comprising a burner (1) having a combustion chamber (5), an oxygen feed (12) and a hydrogen feed (8), an ignition unit (17) and a control unit. Preferred Features: The presence of unburned oxygen is detected upstream of the combustion chamber. The process is stopped when the unburned oxygen is detected. An inert gas is introduced into the process gas when the unburned oxygen is detected.
机译:生产工艺气体的步骤包括在燃烧室中的富氢气氛中燃烧氧气,以形成由水蒸气和氢气制成的气体。还包括用于产生工艺气体的设备的独立权利要求,该设备包括具有燃烧室(5)的燃烧器(1),氧气进料(12)和氢气进料(8),点火单元(17)和燃烧器(1)。控制单元。优选特征:在燃烧室的上游检测到未燃烧的氧气的存在。当检测到未燃烧的氧气时,该过程停止。当检测到未燃烧的氧气时,将惰性气体引入工艺气体中。

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