A heat-shield component with cooling-fluid return includes an outer hollow body and an insert that can both be mounted on a supporting structure. The outer hollow body encloses the insert with a gap. The outer hollow body has a first bottom side which can be exposed to a hot gas. The insert has a second bottom side with a plurality of holes through which the cooling fluid flows into the gap for impact-cooling the first bottom side. A heat-shield configuration for a hot-gas conducting component as well as a heat-shield assembly are also provided.
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