Copolymer of styrene and maleic anhydride and an epoxy resin composition containing co-curing agents

摘要

A resin composition comprising a copolymer of styrene and maleic anhydride (SMA) as cross-linking agent, an epoxy resin, and a co-cross-linking agent, characterized in that the co-cross-linking agent is an optionally brominated bisphenol A (BPA), or an optionally brominated bisphenol A diglycidyl ether (BPADGE), or a mixture thereof, and that the composition is free from an allyl network forming compound. The resin composition may be applied to make laminates and printed wiring boards.