首页>
外国专利>
Hollow solder structure having improved reliabilty and method of manufacturing the same
Hollow solder structure having improved reliabilty and method of manufacturing the same
展开▼
机译:具有改进的可靠性的空心兵器结构及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.
展开▼