首页>
外国专利>
Method of configuring an electronic assembly having an indium thermal coupling, and an electronic assembly having an indium thermal coupling
Method of configuring an electronic assembly having an indium thermal coupling, and an electronic assembly having an indium thermal coupling
展开▼
机译:构造具有铟热耦合的电子组件的方法以及具有铟热耦合的电子组件
展开▼
页面导航
摘要
著录项
相似文献
摘要
According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
展开▼