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Have the suffering evaluation component the high integrated circuit tip/chip and its suffering evaluation component inspection modulo

机译:具有痛苦评估组件的高集成电路尖端/芯片及其痛苦评估组件的检查模块

摘要

PROBLEM TO BE SOLVED: To provide a high integrated circuit chip having an element to be evaluated which can secure an empty space on a chip relatively easily without causing a drop of its integration density, and also to provide a method of inspecting the element.;SOLUTION: In the high integrated circuit chip which can test electrical characteristics of an element to be evaluated formed on the chip via a probe electrode pad contacted by an inspecting probe, the elements to be evaluated with respect to electronic function elements provided on the chip are collectively provided in an empty area around an internal cell region, electrode pads for a probe common thereto are provided, and gaps for securing routes necessary for connection wiring with the electrode pads are provided to the empty area.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种具有要评估的元件的高集成电路芯片,该元件可以相对容易地确保芯片上的空白而不会引起其集成密度的下降,并且还提供一种检查该元件的方法。解决方案:在可以通过与检查探针接触的探针电极垫测试形成在芯片上的待评估元件的电气特性的高集成电路芯片中,相对于芯片上提供的电子功能元件而言,待评估元件为共同地设置在内部单元区域周围的空白区域中,提供用于其共用的探针的电极垫,并且在该空白区域设置用于确保与电极垫的连接配线所需的用于确保布线的路径的间隙。版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP3439410B2

    专利类型

  • 公开/公告日2003-08-25

    原文格式PDF

  • 申请/专利权人 NECエレクトロニクス株式会社;

    申请/专利号JP20000026475

  • 发明设计人 宮崎 徹;

    申请日2000-02-03

  • 分类号H01L21/822;H01L21/66;H01L27/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:22:21

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