Lead/read frame material and electroacoustic transducer null for electroacoustic transducer

摘要

PROBLEM TO BE SOLVED: To lower thermal conductivity and to perform local heating without deteriorating solder wettability by using an alloy in which Ni is contained for a specified wt.% and a remaining part is mainly consisting of Fe, and specifying the grading number of a grain size. ;SOLUTION: This lead frame material for an electroacoustic transducer is for forming reed terminals 10A to 10D in the electroacoustic transducer and is the alloy for which Ni is contained for 32 to 35wt.% by a weight ratio and the remaining part is mainly Fe and the grain size is turned to be the grading number ≥7.0. By performing constitution in such a manner, since the thermal conductivity is lowered, heat radiation is lowered and the local heating required for soldering is made possible. Thus, the damage of the resin of an exterior case or the like by heating for a long time at a high temperature is prevented and the reliability of the electroacoustic transducer is improved. Further, a plate thickness can be made thinner, the heat radiation is lowered, soldering local heating is facilitated and the weight of material used per product is reduced.;COPYRIGHT: (C)1997,JPO