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The electronic components and how to create electronic components that heat sink
The electronic components and how to create electronic components that heat sink
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机译:电子元器件以及如何创建散热片的电子元器件
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摘要
This invention relates to thermal management of electronic devices and circuits and, more particularly, to heat-sinked electronic components that employ synthetic diamond. The invention comprises depositing at a first deposition rate, a first layer of synthetic diamond, of relatively high thermal conductivity, then a second layer, at a second rate, of relatively low thermal conductivity. IMAGE
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