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TOOL FOR PLATING PRINTED-CIRCUIT BOARD AND PLATING METHOD

机译:印制电路板的镀覆工具及镀覆方法

摘要

PROBLEM TO BE SOLVED: To propose a method for simultaneously solving the two major problems with the conventional tool for plating a printed-circuit board; the way how to prolong the life of the tool in order to reduce its running cost and the variation in the thickness of a plating film on the printed-circuit board when the tool is coated with an insulator in order to prolong the life of the tool.;SOLUTION: The tool for plating the printed-circuit board is obtained by forming an insulating film on holding members for holding both ends of the printed-circuit board. Conductive bars to be periodically exchanged are installed thereto, with which the life of the tool is prolonged and the thickness of the plating film is made uniform.;COPYRIGHT: (C)2004,JPO
机译:要解决的问题:提出一种方法,该方法可以同时解决传统工具在印刷电路板上电镀时的两个主要问题。当工具涂有绝缘体以延长工具寿命时,如何延长工具寿命以降低其运行成本以及降低印刷电路板上的镀膜厚度变化的方法解决方案:电镀印刷电路板的工具是通过在用于夹持印刷电路板两端的夹持构件上形成绝缘膜而获得的。将要定期更换的导电棒安装到该导电棒上,从而延长了工具的寿命,并使镀膜的厚度均匀。;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2003293195A

    专利类型

  • 公开/公告日2003-10-15

    原文格式PDF

  • 申请/专利权人 CANON INC;

    申请/专利号JP20020106913

  • 发明设计人 MUTA TADAYOSHI;UEHARA TOSHIYUKI;

    申请日2002-04-09

  • 分类号C25D17/08;C25D17/10;C25D21/00;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-22 00:21:05

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