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TOOL FOR PLATING PRINTED-CIRCUIT BOARD AND PLATING METHOD
TOOL FOR PLATING PRINTED-CIRCUIT BOARD AND PLATING METHOD
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机译:印制电路板的镀覆工具及镀覆方法
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摘要
PROBLEM TO BE SOLVED: To propose a method for simultaneously solving the two major problems with the conventional tool for plating a printed-circuit board; the way how to prolong the life of the tool in order to reduce its running cost and the variation in the thickness of a plating film on the printed-circuit board when the tool is coated with an insulator in order to prolong the life of the tool.;SOLUTION: The tool for plating the printed-circuit board is obtained by forming an insulating film on holding members for holding both ends of the printed-circuit board. Conductive bars to be periodically exchanged are installed thereto, with which the life of the tool is prolonged and the thickness of the plating film is made uniform.;COPYRIGHT: (C)2004,JPO
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