POLYIMIDE TYPE RESIN SOLUTION AND METHOD OF PRODUCING HARDENED PRODUCT AND FLEXIBLE CARRIER PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a resin solution giving a polyimide type resin film having good solvent resistance and reliability of moisture resistance and improving the adhesion to the sealing resin.;SOLUTION: The solution consists of a polymide resin, an epoxy resin and an imidazole compound dissolved and/or dispersed in an organic solvent. In the solution, 0.1-10 parts by weight of an imidazole compound of a melting point (Tm) of 180°C or lower is blended with 100 parts by weight of an epoxy resin, and at least a third of the compound is dispersed in the form of solid particles. The method of preparing the package has a first process of applying the solution onto a flexible board, a second process of drying the resultant board to harden the resin, a third process of arranging semiconductor elements on the board and a fourth process of sealing the elements with a resin at a temperature high than Tm and the hardening temperature.;COPYRIGHT: (C)2003,JPO