METHOD OF MANUFACTURING MICROOPTICAL SYSTEM HAVING THREE-DIMENSIONAL STRUCTURE AND MICROOPTICAL SYSTEM IMPLEMENTING THE SAME

摘要

PROBLEM TO BE SOLVED: To realize a fabrication technique which makes the three-dimensional prealignment and arrangement of device elements possible by assuring optical paths to be passed by light with a configuration in which the elements are arranged in the form of firmly sticking the elements to a substrate like in a flip chip bonding.;SOLUTION: The problem is solved by realizing a method to constitute the microoptical system of a free space type by folding the elements fabricated and arranged by using a photolithography technique on the plane substrate, such as a silicon wafer, together with the substrate, thereby creating a three- dimensional arrangement from a planar arrangement.;COPYRIGHT: (C)2004,JPO