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Side Bali removal feature null of lead/read

机译:Bali Bali移除功能无铅/已读

摘要

PURPOSE: To certainly remove the side burr of a lead frame without deforming the frame by providing a punch pushing off the side burr of the lead frame to the upper mold of a processing apparatus applying the bending processing of a lead while forwardly sending the lead frame after the molding of a resin. ;CONSTITUTION: A side burr removing mechanism is constituted so as to remove side burr 22 in matching relation to the feed operation of a lead frame at the time of the processing of the lead frame and arranged on the side edge side to which the side burr is bonded of the lead frame. A punch 14 letting the side burr fall downwardly is attached to the punch plate 12 arranged on the upper mold of a processing mold. The punch 14 falls simultaneously with the falling of the upper mold to push off the side burr 22.;COPYRIGHT: (C)1994,JPO
机译:用途:为了确保在不使框架变形的情况下去除引线框架的侧边毛边,方法是在向前传送引线框架的同时,向施加弯曲加工的加工设备的上模提供冲头,以将引线框架的侧边毛边推下树脂成型后。 ;构成:侧面毛刺去除机构构成为,在加工引线框架时,与引线框架的进给操作相匹配地去除侧面毛刺22,并且该侧面毛刺布置在侧面毛刺的侧边缘侧连接到引线框架。使侧面毛刺向下下落的冲头14安装在布置在加工模具的上模具上的冲头板12上。冲头14与上模的落下同时落下,以推下侧毛刺22 。;版权所有:(C)1994,日本特许厅

著录项

  • 公开/公告号JP3346603B2

    专利类型

  • 公开/公告日2002-11-18

    原文格式PDF

  • 申请/专利权人 アピックヤマダ株式会社;

    申请/专利号JP19930135581

  • 发明设计人 祖山 英樹;

    申请日1993-06-07

  • 分类号B29C45/38;B29C37/02;H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:36

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