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METHOD AND DEVICE FOR CORRECTING POSITION OF XY STAGE, AND FOR POSITIONING USING THE SAME

机译:用于校正XY台的位置并使用相同位置进行定位的方法和装置

摘要

PROBLEM TO BE SOLVED: To realize a high level of accuracy in positioning for laser machining without increasing price of a device.;SOLUTION: When a pattern arranges a reference mask 30 formed regularly on an XY stage 10 in advance, and the position of the XY stage is corrected based on a coordinate value acquired by photographing positions of respective patterns 32 with a camera 44, scales 20X, 20Y for measuring of a position of the XY stage are corrected by a laser measuring length, the positions of patterns arranged on prescribed lines of the reference mask 30 are obtained based on the scale for the XY stage corrected by the laser measuring length as a reference, and the coordinate value is corrected based on a scale measured value after the correction.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:在不增加装置价格的情况下实现用于激光加工的高水平定位精度;解决方案:当图案预先在XY平台10上规则地形成参考掩模30时,该掩模的位置基于通过利用照相机44拍摄各个图案32的位置而获得的坐标值来校正XY台,通过激光测量长度来校正用于测量XY台的位置的刻度尺20X,20Y,按照规定的方式布置图案的位置基于通过激光测量长度作为参考的XY台的比例尺获得参考掩模30的线,并且基于校正之后的比例尺测量值来校正坐标值。COPYRIGHT:(C)2003,日本特许厅

著录项

  • 公开/公告号JP2003233424A

    专利类型

  • 公开/公告日2003-08-22

    原文格式PDF

  • 申请/专利权人 SUMITOMO HEAVY IND LTD;

    申请/专利号JP20020034638

  • 发明设计人 KOBAYASHI IZUSHI;

    申请日2002-02-12

  • 分类号G05D3/12;G01B11/00;G12B5/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:26

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