首页> 外国专利> HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AND ITS LAMINATE

HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE, HEAT CONDUCTIVE PRESSURE SENSITIVE ADHESIVE SHEET AND ITS LAMINATE

机译:导热压敏胶板,导热压敏胶板及其层压板

摘要

PROBLEM TO BE SOLVED: To obtain a heat conductive pressure sensitive adhesive excellent in heat conductive performance and having flexibility, shape followingness and good adhesiveness, and to provide a heat conductive pressure sensitive adhesive sheet and a laminate using the sheet.;SOLUTION: The adhesive comprises (a) a copolymer of 50-97 pts.wt. which contains an alkyl acrylate having a 2-18C alkyl group, (b) a compound of 3-50 pts.wt. which is not compatible with the copolymer (a) and has a melting point of 40-80°C and (c) a heat conductive particulate of 10-500 pts.wt.;COPYRIGHT: (C)2003,JPO
机译:要解决的问题:获得导热性能优异并且具有柔韧性,形状跟随性和良好粘合性的导热压敏胶粘剂,并提供导热压敏胶粘片和使用该片的层压体。包含(a)50-97pts.wt的共聚物。其中含有具有2-18C烷基的丙烯酸烷基酯,(b)3-50 pts.wt的化合物。它与共聚物(a)不兼容,熔点为40-80°C;(c)导热颗粒为10-500 pts.wt .;版权:(C)2003,JPO

著录项

  • 公开/公告号JP2003105299A

    专利类型

  • 公开/公告日2003-04-09

    原文格式PDF

  • 申请/专利权人 SEKISUI CHEM CO LTD;

    申请/专利号JP20010302346

  • 发明设计人 HYOZU SHUNJI;AZUMA KENICHI;TOGAWA KATSUYA;

    申请日2001-09-28

  • 分类号C09J133/08;C09J7/00;C09J11/04;C09J11/06;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:10

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