首页> 外国专利> VEGETATION PC PLATE IN CUT REINFORCING SURFACE AND VEGETATION STRUCTURE IN CUT REINFORCING SURFACE USING THIS VEGETATION PC PLATE

VEGETATION PC PLATE IN CUT REINFORCING SURFACE AND VEGETATION STRUCTURE IN CUT REINFORCING SURFACE USING THIS VEGETATION PC PLATE

机译:切割补强表面的植被PC板和使用该植被PC补强切割表面的植被结构

摘要

PPROBLEM TO BE SOLVED: To solve of problem of lacking in harmony with nature in a concrete bared cut reinforcing surface. PSOLUTION: PC plates 2, 2a, etc., are arranged on and fixed to a cut slope face, and are composed of a rectangular PC plate 12 and vegetation PC plates 11, 11a, etc., for forming large chamfer parts 13, 13a, etc., in at least one corner part. Vegetation recessed parts 14, 14a, etc., are formed in a boundary part of the PC plates 2, 2a, etc., by the chamfer parts 13, 13a, etc., of the vegetation PC plates 11, 11a, etc. Vegetation soil 19 is housed in the vegetation recessed parts 14, 14a, etc. The cut reinforcing surface 1 for planting plants 20 in the vegetation soil 19 is constructed. The plants 20 can be planted in the cut reinforcing surface 1, and the plants 20 can surely be raised by the vegetation soil 19. PCOPYRIGHT: (C)2003,JPO
机译:

要解决的问题:解决混凝土裸露的增强表面中与自然缺乏和谐的问题。

解决方案:PC板2、2a等被布置并固定在切割的斜面上,并且由矩形PC板12和植物PC板11、11a等组成,用于形成较大的倒角部分在至少一个拐角部分中具有图13、13a等。植被凹入部分14、14a等通过植物PC板11、11a等的倒角部分13、13a等形成在PC板2、2a等的边界部分中。将土壤19容纳在植被凹入部分14、14a等中。构造用于在植被土壤19中种植植物20的切割增强表面1。可以将植物20种植在切开的增强表面1中,并且可以肯定地通过植被土壤19来种植植物20。

版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2003171938A

    专利类型

  • 公开/公告日2003-06-20

    原文格式PDF

  • 申请/专利权人 TECHNO SUPPORT:KK;

    申请/专利号JP20010373542

  • 发明设计人 NAKAGAKI TOSHIFUMI;IMAI MASAKI;

    申请日2001-12-07

  • 分类号E02D17/20;A01G1/00;A01G9/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:18:35

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