MANUFACTURING METHOD FOR BOTH-SIDE WIRING TAPE CARRIER AND TAPE CARRIER USING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a manufacturing method for a both-side wiring tape carrier in the structure that the inside of via hole of an inter-layer connection part is filled with a metal by a plating method without leaving a void inside the plating metal, capable of simplifying processes and performing manufacturing at a low cost. PSOLUTION: A metal coated polyimide base provided with metal layers including at least copper layers on both surfaces without interposing an adhesive material is used, and a pattern for opening the via holes is formed by a photoetching method at the metal layer on one or both surfaces of the metal coated polyimide base. Using the pattern as a mask, a blind via hole is formed in a polyimide layer by a polyimide etching method by an alkali solution or by irradiating the base with a carbon dioxide laser or an Ar laser. The copper layer is exposed by removing the metal layer exposed at an external land via hole bottom surface, and plating is precipitated from the copper layer surface exposed at the blind via hole bottom surface and electrically connected with the metal layer constituting the pattern for opening the via hole. PCOPYRIGHT: (C)2003,JPO