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Thermometry device null of the die component which it forms processes the glass formation item

机译:所形成的模具部件的测温装置无效处理玻璃形成项目

摘要

PROBLEM TO BE SOLVED: To measure the temperature accurately where a glass material is molded through heating under pressure by securing a member having coefficient of thermal expansion higher than that of a member for measuring the temperature to the forward end of a thermocouple. ;SOLUTION: Upper and lower dies 1, 2 for molding a heated glass material 7 is provided with temperature measuring holes 8, 9. Thermocouple units 10, 11 are fixed, at the forward end thereof, with a tubular member having coefficient of thermal expansion higher than that of the upper and lower dies 1, 2 and secured to the temperature measuring holes 8, 9 through the tubular member. A space of specified dimensions is set between the tubular member and the temperature measuring holes 8, 9 prior to glass molding operation such that they come into contact with each other in the environment of glass molding temperature. Consequently, the thermocouple units 10, 11 are not subjected to clearance and can be mounted/demounted easily. According to the method, temperature can be measured with high accuracy approximately corresponding to that of actual temperature even under vacuum.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:通过将热膨胀系数比用于测量温度的构件的热膨胀系数高的构件固定到热电偶的前端,来精确地测量通过加压加热成型玻璃材料时的温度。 ;解决方案:用于模制加热的玻璃材料的上模1,下模2设有测温孔8、9。热电偶单元10、11在其前端固定有具有热膨胀系数的管状部件。高度比上下模具1、2高,并通过管状部件固定到温度测量孔8、9。在玻璃模制操作之前,在管状构件和温度测量孔8、9之间设置特定尺寸的空间,使得它们在玻璃模制温度的环境中彼此接触。因此,热电偶单元10、11没有间隙,并且可以容易地安装/拆卸。根据该方法,即使在真空下也能以近似于实际温度的高精度测量温度。版权所有:(C)1998,日本特许厅

著录项

  • 公开/公告号JP3363716B2

    专利类型

  • 公开/公告日2003-01-08

    原文格式PDF

  • 申请/专利权人 キヤノン株式会社;

    申请/专利号JP19960262909

  • 发明设计人 山本 潔;中川 伸行;

    申请日1996-10-03

  • 分类号G01K1/16;C03B11/12;G01K7/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:17:40

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