FLAKE COPPER POWDER, MANUFACTURING METHOD THEREFOR, AND FLAKE COPPER PASTE USING THE FLAKE COPPER POWDER

摘要

PROBLEM TO BE SOLVED: To provide a flake copper powder which can simultaneously realize characteristics of both stably low electric resistance of a conductor, and good fillability for a via hole or the like, when the powder has been processed for a copper paste and used for forming the conductor.;SOLUTION: The flake copper powder with grain sizes of 10 μm or less is characterized by a value of SD/D₅₀ of 0.5 or less and a value of D₉₀/D₁₀ of 4.0 or less, where D₁₀, D₅₀, D₉₀ are weight cumulative grain sizes of the flake copper powder, and SD is a standard deviation of particle size distribution, each of which is measured by a laser diffraction scattering type grain size distribution measurement method.;COPYRIGHT: (C)2003,JPO