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LOAD CUP FOR MECHANICAL AND CHEMICAL POLISHING DEVICE, MECHANICAL AND CHEMICAL POLISHING DEVICE, AND TRANSFER METHOD FOR SUBSTRATE
LOAD CUP FOR MECHANICAL AND CHEMICAL POLISHING DEVICE, MECHANICAL AND CHEMICAL POLISHING DEVICE, AND TRANSFER METHOD FOR SUBSTRATE
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机译:机械和化学抛光装置的载荷杯,机械和化学抛光装置以及基质的转移方法
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摘要
PROBLEM TO BE SOLVED: To provide a load cup for a mechanical and chemical polishing device, a mechanical and chemical polishing device, and a transfer method for a substrate capable of securely transferring the substrate held on a polishing head to a substrate support member of the load cup. ;SOLUTION: This load cup 4 of a CMP device 1 has a pedestal 12 supporting a wafer W, and three substrate grip members 23 gripping the wafer W by pressing an edge of the wafer W are arranged on a side of the pedestal 12. Each substrate grip member 23 has two protruding parts 26 for pressing protruding inward, and a claw part 27 for catching and holding the wafer W is provided on a pressing face of the protruding part 26 for pressing. A tapered face 27a inclined downward is formed in the claw part 27. Each substrate grip member 23 is connected to an L-shaped arm 28, which is turned by an air cylinder 30 to open and close each substrate grip member 23.;COPYRIGHT: (C)2003,JPO
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