首页> 外国专利> DRAWING DATA GENERATING SYSTEM, DRAWING DATA GENERATING METHOD, DRAWING DATA GENERATING PROGRAM, METHOD FOR PRODUCING RETICLE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

DRAWING DATA GENERATING SYSTEM, DRAWING DATA GENERATING METHOD, DRAWING DATA GENERATING PROGRAM, METHOD FOR PRODUCING RETICLE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

机译:绘图数据生成系统,绘图数据生成方法,绘图数据生成程序,掩模版的制造方法以及制造半导体装置的方法

摘要

PROBLEM TO BE SOLVED: To generate mask drawing data in which the number of master masks to be generated can be minimized. SOLUTION: The method for generating drawing data comprises a step (S101) for generating chip division information by dividing a chip pattern such that pattern data obtained by enlarging the chip pattern data of a reticle is contained in the drawing area of a master mask, generating chip layout information of the master mask by assigning the division patterns in the chip division information sequentially to the master mask in the ascending order and registering the chip layout information in a master mask chip layout information memory, a step (S102) for generating the chip pattern data of the master mask by dividing each chip according to the chip layout information of the master mask with reference to the chip pattern data of the reticle and registering the chip pattern data of the master mask in a master mask pattern data memory, and a step (S103) for generating master mask drawing data with reference to the chip layout information of the master mask and the chip pattern data of the master mask.
机译:解决的问题:生成蒙版图形数据时,可以将要生成的主蒙版的数量最小化。解决方案:产生绘图数据的方法包括步骤(S101),该步骤(S101)用于通过分割芯片图案来生成芯片分割信息,以使通过放大标线片的芯片图案数据而获得的图案数据包含在主掩模的绘图区域中,从而产生通过将芯片划分信息中的划分图案按升序顺序分配给主掩模并将芯片布局信息注册在主掩模芯片布局信息存储器中,来形成主芯片的步骤(S102)通过参考掩模版的芯片图案数据根据主掩模的芯片布局信息划分每个芯片并且将主掩模的芯片图案数据注册在主掩模图案数据存储器中,通过将主掩模的图案数据划分为主掩模的图案数据,步骤(S103),用于参考主掩模的芯片布局信息和晶片的芯片图案数据生成主掩模图形数据。主面具。

著录项

  • 公开/公告号JP2003022952A

    专利类型

  • 公开/公告日2003-01-24

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20010206541

  • 发明设计人 YANO MITSUHIRO;WATANABE SUSUMU;

    申请日2001-07-06

  • 分类号H01L21/027;G03F1/08;G03F7/20;

  • 国家 JP

  • 入库时间 2022-08-22 00:14:22

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