首页> 外国专利> METHOD FOR MANUFACTURING COPPER POWDER, COPPER POWDER, ELECTROCONDUCTIVE PASTE, AND LAMINATED CERAMIC ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING COPPER POWDER, COPPER POWDER, ELECTROCONDUCTIVE PASTE, AND LAMINATED CERAMIC ELECTRONIC COMPONENT

机译:制备铜粉,铜粉,导电浆料和层状陶瓷电子元件的方法

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper powder which is superior in dispersibility and heat contraction and has a high sintering-initiation temperature, to provide the copper powder manufactured by the method, an electroconductive paste using the copper powder and a laminated ceramic electronic component provided with an electrode formed by the use of the conductive paste.;SOLUTION: This manufacturing method comprises reducing a raw liquid containing copper salts, calcium compounds and water with a hydrazine-based reducing agent, to precipitate the copper powder containing calcium. A ratio (Ca/(Cu+Ca)) of calcium (Ca) to copper (Cu) in the raw liquid is in a range of 0.05-1.0 wt.%.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种制造铜粉的方法,该铜粉的分散性和热收缩性优异并且具有高的烧结起始温度,以提供通过该方法制造的铜粉,使用该铜粉的导电浆料和用于制造铜粉的导电胶。解决方案:该制造方法包括用肼基还原剂还原含有铜盐,钙化合物和水的原液,使含有铜盐的铜粉沉淀出来。钙。原液中钙(Ca)与铜(Cu)的比例(Ca /(Cu + Ca))在0.05-1.0 wt。%的范围内;版权:(C)2003,JPO

著录项

  • 公开/公告号JP2003160804A

    专利类型

  • 公开/公告日2003-06-06

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP20010357429

  • 发明设计人 NAKAMURA TAKEJI;

    申请日2001-11-22

  • 分类号B22F9/24;H01B1/22;H01G4/12;

  • 国家 JP

  • 入库时间 2022-08-22 00:13:42

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