Test board de-embedding method to improve RF measurements accuracy on an automatic testing equipment for IC wafers

摘要

The present invention relates to method to improve RF measurements accuracy on an automatic testing equipment (ATE) for IC wafers by implementing a test board de-embedding phase, wherein each wafer includes a device under test located on a wafer die plane and being contacted by probecard needles of a probecard that is coupled to a configuration board through a probe interface board (PIB), the method including the following phases: performing an automatic calibration phase of the testing equipment up to an internal plane located inside the automatic testing equipment; performing a calibration plane transfer up to a plane of the configuration board using a predetermined number of calibration standard loads realized on the wafer; performing a test boards de-embedding phase up to the wafer die plane.