Ultra-fine alignment system and method using acoustic-AFM interaction

摘要

Systems and methods for deciphering an alignment feature are disclosed. A feature is provided on a semiconductor wafer having an elasticity that is different from material surrounding the feature. A stress is applied to the wafer, the feature is scanned with an atomic force microscope to determine a position of the feature. The position of the feature is based on an elasticity difference detected between the feature and the material surrounding the feature.