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Method of forming S/D extension regions and pocket regions based on formulated relationship between design and measured values of gate length

机译:基于设计和浇口长度测量值之间的公式化关系形成S / D延伸区和袋状区的方法

摘要

The relationship between the difference between design and measured values of the gate length of a gate electrode of a transistor and the dose of an impurity to be injected into SD extension regions or pocket regions which is necessary to equalize characteristics of the transistor to design values is formulated. The gate length of the gate electrode which is produced by photolithography and etching process is measured. The dose of the impurity to be injected into the SD extension regions or the pocket regions is adjusted to bring deviations of the characteristics of the transistor from the design values into a predetermined range, based on the measured value of the gate length and the formulated relationship.
机译:晶体管的栅极的栅极长度的设计值和测量值之间的差与将晶体管的特性均等化至设计值所需的注入到SD扩展区域或袋状区域中的杂质的剂量之间的关系是制定。测量通过光刻和蚀刻工艺产生的栅电极的栅极长度。基于栅极长度的测量值和公式化的关系,调节注入到SD扩展区域或袋状区域中的杂质的剂量,以使晶体管的特性与设计值的偏差达到预定范围。 。

著录项

  • 公开/公告号US6518075B2

    专利类型

  • 公开/公告日2003-02-11

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号US20010835517

  • 发明设计人 ATSUKI ONO;

    申请日2001-04-17

  • 分类号H01L216/60;G01R312/60;

  • 国家 US

  • 入库时间 2022-08-22 00:07:08

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