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IC card having fingerprint sensor designed to withstand bending

机译:具有指纹传感器的IC卡设计成可承受弯曲

摘要

A chip card comprising a card made from a plastics material (1) capable of elastically withstanding a relative bending and in which a microelectronic data processing chip (4) is encased, a thin microelectronic wafer (5) made from a semiconductor material, such as a finger print sensor, additionally being joined to the card (1). Said wafer (5) is sub-divided into a small number of juxtaposed chips (7) disposed in a given pattern and separated from one another by a predetermined distance (d) which is sufficient for each separating strip (8) of plastics material to be slightly bent without causing adjacent chips (7) to become unstuck and/or rupture; electrical links are established between the chips to provide electrical continuity.
机译:一种芯片卡,其包括由能够弹性承受相对弯曲的塑料材料( 1 )制成的卡,并且其中封装有微电子数据处理芯片( 4 ),由半导体材料(例如指纹传感器)制成的薄微电子晶圆( 5 ),还与卡( 1 )接合。所述晶片( 5 )被细分为以给定图案布置并彼此隔开预定距离(d)的少量并列芯片( 7 )。这足以使每个塑料分隔条( 8 )稍微弯曲而不会导致相邻的碎屑( 7 )松开和/或破裂;在芯片之间建立电连接以提供电连续性。

著录项

  • 公开/公告号US6494380B2

    专利类型

  • 公开/公告日2002-12-17

    原文格式PDF

  • 申请/专利权人 SAGEM SA;

    申请/专利号US20010757835

  • 发明设计人 HERV JAROSZ;

    申请日2001-01-11

  • 分类号G06K190/00;

  • 国家 US

  • 入库时间 2022-08-22 00:06:52

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