首页> 外国专利> Vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, SOI and thin film structures and method of forming same

Vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, SOI and thin film structures and method of forming same

机译:(110),(111),(311),(511)以及块,SOI和薄膜结构的高阶表面上的垂直亚微米CMOS晶体管及其形成方法

摘要

A method for forming NMOS and PMOS transistors that includes cutting a substrate along a higher order orientation and fabricating deep sub-micron NMOS and PMOS transistors on the vertical surfaces thereof. The complementary NMOS and PMOS transistors form a CMOS transistor pair. The transistors are preferably used in structures such as memory circuits, e.g., DRAMs, which are, in turn, used in a processor-based system. Ideally, the deep sub-micron NMOS and PMOS transistors are operated in velocity saturation for optimal switching operation.
机译:一种用于形成NMOS和PMOS晶体管的方法,该方法包括沿更高阶的取向切割衬底,并在其垂直表面上制造深亚微米的NMOS和PMOS晶体管。互补的NMOS和PMOS晶体管形成CMOS晶体管对。晶体管优选用于诸如存储器电路之类的结构中,例如DRAM,这些结构又用于基于处理器的系统中。理想地,深亚微米NMOS和PMOS晶体管在速度饱和下工作,以实现最佳开关操作。

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号