首页> 外国专利> Flexible cable, flexible cable mount method, semiconductor device with flexible cable, led array head with flexible cable, image forming apparatus with such led array head

Flexible cable, flexible cable mount method, semiconductor device with flexible cable, led array head with flexible cable, image forming apparatus with such led array head

机译:挠性电缆,挠性电缆的安装方法,具有挠性电缆的半导体装置,具有挠性电缆的led阵列头,具有该led阵列头的图像形成装置

摘要

Distortion of an LED array head is eliminated by correcting an electrode pitch misalignment between an LED array substrate and a driver substrate to be caused by thermal expansion or contraction during thermal pressure bonding of a flexible cable. A tear preventing hole is formed in each area between adjacent four-divided areas of the flexible cable. When positions of the flexible cable and driver substrate are to be aligned, a pitch shift adjusting slit line is cut in order to correct the position misalignment to be caused by thermal expansion or contraction generated when the flexible cable is thermal-pressure bonded to the LED substrate. The pitch shift adjusting slit line is formed in the connection area between adjacent four-divided areas.
机译:通过校正由柔性电缆的热压接合期间的热膨胀或收缩引起的LED阵列基板和驱动器基板之间的电极间距失准,来消除LED阵列头的变形。在柔性电缆的相邻四划分区域之间的每个区域中形成防撕裂孔。当将挠性电缆和驱动器基板的位置对准时,切开节距偏移调整狭缝线以校正由于将挠性电缆热压结合到LED时产生的热膨胀或收缩而引起的位置对准。基质。在相邻的四划分区域之间的连接区域中形成有变调调整缝线。

著录项

  • 公开/公告号US6611280B1

    专利类型

  • 公开/公告日2003-08-26

    原文格式PDF

  • 申请/专利权人 CANON KABUSHIKI KAISHA;

    申请/专利号US20000626487

  • 发明设计人 TOSHIYUKI SEKIYA;MITSUO SHIRAISHI;

    申请日2000-07-26

  • 分类号B41J24/50;B41J23/85;

  • 国家 US

  • 入库时间 2022-08-22 00:05:58

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