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IC package capable of accommodating discrete devices
IC package capable of accommodating discrete devices
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机译:能够容纳分立器件的IC封装
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摘要
An IC (Integrated Circuit) package includes a package body having a cavity formed for receiving an IC chip therein. A terrace protrudes from at least part of the edges defining the cavity into the cavity. Discrete devices can be mounted on the terrace, i.e., inside the IC package. With this configuration, the IC package insures the stable operation of a high-frequency IC circuit.
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