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Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array

机译:微结构阵列及其制造方法,用于形成微结构阵列的模具和微透镜阵列

摘要

In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.
机译:在制造微结构阵列的方法中,提供具有导电部分的基板,在基板的导电部分上形成绝缘掩模层,在绝缘掩模层中形成多个开口以暴露出导电部分,并且通过电镀或化学镀或电沉积在开口中和绝缘掩模层上沉积第一电镀或电沉积层。使第一镀层或电沉积层的至少一个表面导电。之后,去除绝缘掩模层,并通过电镀在第一电镀或电沉积层上以及在导电部分上形成第二电镀层,以将第一电镀或电沉积层牢固地固定至基板。

著录项

  • 公开/公告号US6503384B1

    专利类型

  • 公开/公告日2003-01-07

    原文格式PDF

  • 申请/专利权人 CANON KABUSHIKI KAISHA;

    申请/专利号US20000536128

  • 发明设计人 TAKAYUKI YAGI;TAKAYUKI TESHIMA;

    申请日2000-03-28

  • 分类号C25D50/20;B29D110/00;

  • 国家 US

  • 入库时间 2022-08-22 00:04:25

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