PROCESS FOR MECHANICAL CHEMICAL POLISHING OF A LAYER OF ALUMINIUM OR ALUMINIUM ALLOY CONDUCTING MATERIAL

摘要

Process for mechanical chemical polishing of a layer of an aluminium oraluminium alloy conducting material used in the microelectronics semi-conductors industry in which said aluminium or aluminium alloy layer is abradedusing an abrasive composition which comprises an alkaline aqueous suspensionof individualized colloidal silica particles not linked to each other by siloxanebonds, a tetraalkylammonium hydroxide and an oxidizing agent.