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ELECTROLYSIS BATH FOR ELECTRODEPOSITING SILVER-TIN ALLOYS

机译:电镀锡银合金的电解槽

摘要

The invention relates to an electrolysis bath for electrodepositing silver-tin alloys that, in addition to water serving as a solvent with a pH value of less than 1.5, contains a water-soluble silver compound, a water-soluble tin compound and an organic complexing agent. In order to obtain a stable electrolysis bath that enables the homogenous deposition of a compact tin-silver alloy with any type of composition, an aliphatic complexing agent having a sulfide group and an amino group is used as a complexing agent, whereby said functional groups are bound to different carbon atoms.
机译:本发明涉及一种用于电沉积银-锡合金的电解浴,该电解浴除了用作pH值小于1.5的溶剂的水外,还包含水溶性银化合物,水溶性锡化合物和有机络合物。代理商。为了获得能够使致密的锡-银合金以任何类型的成分均匀沉积的稳定的电解浴,使用具有硫化基和氨基的脂族络合剂作为络合剂,其中所述官能团是绑定到不同的碳原子。

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