首页> 外国专利> METHOD FOR JOINING A DIAMOND LAYER TO A SUBSTRATE, AND DIAMOND-COATED SUBSTRATE

METHOD FOR JOINING A DIAMOND LAYER TO A SUBSTRATE, AND DIAMOND-COATED SUBSTRATE

机译:将金刚石层连接到基体的方法以及金刚石涂层基体

摘要

The invention relates to a method for producing a substrate (1) coated with a diamond layer (2). According to the inventive method, a substrate (1) is prepared, said substrate having a layer (3) which extends from the surface (O) of the substrate towards the inside, comprises recesses (4) extending from the surface (O) towards the inside, and is elastically and/or plastically deformable in an xy-plane which is parallel to the surface (O), and a diamond layer (2) engaging in the recesses is then produced by means of a CVD method. Cooling stresses occurring in the diamond layer (2) during cooling are essentially compensated by an elastic and/or plastic deformation of the layer (3) in the xy-plane.
机译:本发明涉及一种制备涂覆有金刚石层(2)的基材(1)的方法。根据本发明的方法,制备衬底(1),所述衬底具有从衬底的表面(O)朝向内部延伸的层(3),其包括从表面(O)朝向表面延伸的凹槽(4)。在内部,并且在平行于表面(O)的xy平面内可弹性和/或塑性变形,然后通过CVD方法制造接合在凹部中的金刚石层(2)。冷却期间在金刚石层(2)中产生的冷却应力基本上由层(3)在xy平面内的弹性和/或塑性变形来补偿。

著录项

  • 公开/公告号AU2003226824A1

    专利类型

  • 公开/公告日2003-11-10

    原文格式PDF

  • 申请/专利号AU20030226824

  • 发明设计人 STEFAN ROSIWAL;

    申请日2003-04-23

  • 分类号C23C16/27;C23C16/02;

  • 国家 AU

  • 入库时间 2022-08-21 23:56:45

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