AN ABSOLUTE MICROMACHINED SILICON PRESSURE SENSOR WITH BACKSIDE HERMETIC COVER AND METHOD OF MAKING THE SAME

摘要

An absolute micromachined silicon pressure sensor (30) provides the resistive or piezoresistive strain gauges (48), conductive traces (52), wirebond pads (50) and other electrical components on a micromachined silicon die (32) in a location that is isolated from the sensed fluid. This protects the electronic components (48, 50, 52) from the corrosive effects of the sensed fluid. A hermetic cover (54) is provided on the backside of the silicon die (32) and is directly bonded thereto to create a hermetically sealed volume (56) of gas or vacuum.