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METHOD FOR PATTERNING THICK-FILM PASTE MATERIAL LAYER, METHOD FOR MANUFACTURING COLD-CATHODE FIELD ELECTRON EMISSION DEVICE, AND METHOD FOR MANUFACTURING COLD-CATHODE FIELD ELECTRON EMISSION DISPLAY
METHOD FOR PATTERNING THICK-FILM PASTE MATERIAL LAYER, METHOD FOR MANUFACTURING COLD-CATHODE FIELD ELECTRON EMISSION DEVICE, AND METHOD FOR MANUFACTURING COLD-CATHODE FIELD ELECTRON EMISSION DISPLAY
A cold-cathode field electron emission device manufacturing method, wherein a cathode (11), an insulating layer (12), and a gate electrode (13) are formed, an opening (14) is formed in the gate electrode (13) and the insulating layer (12) to exposed the cathode (11), a resist material layer (20) covering the side face of the opening (14), the gate electrode (13), and the insulating layer (12) is formed, a modified layer (21) is formed by modifying the surface of the resist material layer, an electron emitting part (15) composed of a thick-film paste material layer (22) is formed on the cathode (11) located on the bottom of the opening (14), and the resist material layer (20) is removed.
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