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Coating element for an electrical junction or circuit and method of reducing surface electric field density of an electrical junction or circuit using such a coating element

机译:用于电结或电路的涂层元件以及使用这种涂层元件降低电结或电路的表面电场密度的方法

摘要

A coating element for an electrical junction or circuit (10) reduces surface electric field densities. The coating element (30) comprises a layer of plastic material laden with or in which there are dispersed conductive particles. The coating element (30) surrounds the junction or circuit (10) such that an inner layer or surface of the element is in contact with the outer layer or surface of the junction or circuit (10) . The plastic material may be an elastomer, a polymer, a polyurethane or a silicone. The conductive particles may be a metal powder of aluminum or stainless steel or graphite. The resistivity of the coating element is between about 1 ohm-cm to about 100 kilohm-cm.
机译:用于电结或电路(10)的涂层元件降低了表面电场密度。涂层元件(30)包括一层塑料材料,其上装有或分散有导电颗粒。涂层元件(30)围绕结或电路(10),使得该元件的内层或表面与结或电路(10)的外层或表面接触。该塑料材料可以是弹性体,聚合物,聚氨酯或硅树脂。导电颗粒可以是铝或不锈钢的金属粉末或石墨。涂层元件的电阻率在约1欧姆-厘米至约100千瓦-厘米之间。

著录项

  • 公开/公告号EP1271562A1

    专利类型

  • 公开/公告日2003-01-02

    原文格式PDF

  • 申请/专利号EP20020254293

  • 发明设计人 JEDLITSCHKA HANS;

    申请日2002-06-20

  • 分类号H01B1/20;H01B1/22;H05K9/00;C08K3/08;

  • 国家 EP

  • 入库时间 2022-08-21 23:50:55

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