首页> 外国专利> Apparatus for cutting thin slabs or slices from thicker quarry stone slabs, and method for making panels covered with said slices

Apparatus for cutting thin slabs or slices from thicker quarry stone slabs, and method for making panels covered with said slices

机译:从较厚的采石场石板上切割薄板或切片的设备,以及用所述切片覆盖的板的制造方法

摘要

The invention relates to an apparatus for cutting stones, such as marbles, granites or the like, and particularly for cutting thin slabs or slices from thicker slabs (3), comprising at least one cutting device (7, 8) having at least one endless flexible diamond impregnated tool (8). In the apparatus of the invention, said cutting device (7, 8) is oriented along a horizontal or substantially horizontal cutting plane, the slab to be cut (3) being itself oriented along a horizontal plane, and there being provided means (4) for relative displacement of the cutting device (7, 8) and the slab (3) to be sliced in the forward cutting direction into the slab (3). The invention also relates to a method for making laminate panels having at least one substrate layer and at least one covering layer joined together, the covering layer consisting of a thin slab or slice made of a stony material, and fabricated by the apparatus of the invention.
机译:用于切割石材的设备技术领域本发明涉及一种用于切割诸如大理石,花岗岩等的石头的设备,并且特别是用于从较厚的平板(3)切割薄的平板或切片的设备,该设备包括至少一个具有至少一个环形的切割装置(7、8)。柔性金刚石浸渍工具(8)。在本发明的设备中,所述切割装置(7、8)沿水平或基本水平的切割平面定向,待切割的板坯(3)本身沿水平面定向,并且设有装置(4)。用于将切割装置(7、8)和板坯(3)沿向前切割方向切成板坯(3)的相对位移。本发明还涉及一种制造层压板的方法,该层压板具有结合在一起的至少一个基底层和至少一个覆盖层,该覆盖层由由石质材料制成的薄板或薄片组成,并且通过本发明的设备制造。

著录项

  • 公开/公告号EP1316398A2

    专利类型

  • 公开/公告日2003-06-04

    原文格式PDF

  • 申请/专利权人 BENETTI IMPIANTI S.R.L.;

    申请/专利号EP20020025907

  • 发明设计人 ENRICO BENETTI;

    申请日2002-11-20

  • 分类号B28D1/08;B28D1/00;B28D1/12;

  • 国家 EP

  • 入库时间 2022-08-21 23:49:40

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