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Apparatus for cutting thin slabs or slices from thicker quarry stone slabs, and method for making panels covered with said slices
Apparatus for cutting thin slabs or slices from thicker quarry stone slabs, and method for making panels covered with said slices
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机译:从较厚的采石场石板上切割薄板或切片的设备,以及用所述切片覆盖的板的制造方法
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摘要
The invention relates to an apparatus for cutting stones, such as marbles, granites or the like, and particularly for cutting thin slabs or slices from thicker slabs (3), comprising at least one cutting device (7, 8) having at least one endless flexible diamond impregnated tool (8). In the apparatus of the invention, said cutting device (7, 8) is oriented along a horizontal or substantially horizontal cutting plane, the slab to be cut (3) being itself oriented along a horizontal plane, and there being provided means (4) for relative displacement of the cutting device (7, 8) and the slab (3) to be sliced in the forward cutting direction into the slab (3). The invention also relates to a method for making laminate panels having at least one substrate layer and at least one covering layer joined together, the covering layer consisting of a thin slab or slice made of a stony material, and fabricated by the apparatus of the invention.
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