首页> 外国专利> ADVANCED TAP LINKING MODULE APPARATUS FOR TESTING SYSTEM ON CHIP COMPRISING IP CORES

ADVANCED TAP LINKING MODULE APPARATUS FOR TESTING SYSTEM ON CHIP COMPRISING IP CORES

机译:用于在包含IP核的芯片上测试系统的高级TAP链接模块设备

摘要

PURPOSE: A tap linking module(TLM) apparatus is provided to reduce design time by using IEEE 1149.1 as a standard for board testing without modification, and to perform an individual IP core test, connection checking between IP cores and chip testing. CONSTITUTION: A TLM is placed at a lower part of a system-on-chip on a board, and receives signals(TMS,TRST,TDO) to provide signals(SCE_EN,ENA,Reset) so as to dynamically control connections of respective TAPs. State condition expanders(SCE1,SCE2,SCE3,SCE4) are supplied with signals(SCE_EN,ENA) from the TLM. The state condition expanders(SCE1,SCE2,SCE3,SCE4) provide to respective TAP TMS signals for activating or inactivating respective TAPs(TAP1,TAP2,TAP3,TAP4) so as to have the same state transition as the TLM.
机译:目的:提供一种分接链接模块(TLM)设备,以通过使用IEEE 1149.1作为无需修改的板级测试标准来减少设计时间,并执行单独的IP内核测试,IP内核之间的连接检查和芯片测试。构成:TLM放置在板上片上系统的下部,并接收信号(TMS,TRST,TDO)以提供信号(SCE_EN,ENA,Reset),以便动态控制各个TAP的连接。从TLM向状态条件扩展器(SCE1,SCE2,SCE3,SCE4)提供信号(SCE_EN,ENA)。状态条件扩展器(SCE1,SCE2,SCE3,SCE4)向相应的TAP TMS提供信号,以激活或停用相应的TAP(TAP1,TAP2,TAP3,TAP4),以便具有与TLM相同的状态转换。

著录项

  • 公开/公告号KR20030010391A

    专利类型

  • 公开/公告日2003-02-05

    原文格式PDF

  • 申请/专利权人 PARK SUNG JU;

    申请/专利号KR20010045309

  • 发明设计人 PARK SUNG JU;SONG JAE HUN;

    申请日2001-07-27

  • 分类号G01R31/28;

  • 国家 KR

  • 入库时间 2022-08-21 23:47:48

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