Apparatus and Method for Evaluating Degree of Adhesion of Adherents to Mold Surface Apparatus and Method for Surface Treatment of Mold Surface and Method and Apparatus for Cleaning Mold Used for Molding Resin

摘要

PURPOSE: A device and method for evaluating the adhesion degree of attachments of a mold surface, a device and method for treating the mold surface, and a device and method for cleaning a mold for molding resin are provided to quantitatively evaluate the adhesion degree of foreign materials and to improve the efficiency and automatization of a resin molding process and increase the yield of molded products. CONSTITUTION: A device for evaluating the adhesion degree of attachments of a mold surface is composed of an operation unit(20) and a comparator unit(21). The operation unit calculates measurements indicating the adhesion degree of foreign materials on lower and upper molds(1,2) and the mold surface based on detection signals from lower and upper sensors(13,14) mounted on the top and bottom of a sensor unit(10). The comparator unit compares each measurement from the operation unit with a predetermined reference value and transmits a predetermined warning signal if the measurement is below the reference value. The warning signal is transmitted if the intensity of reflected lights(16,18) for irradiated lights(15,17) reflected from the mold surface is below the reference value.