Poly imide / poly ethylene terephthalate hybrid films with good ahdesion, and method for preparing them

摘要

PURPOSE: A high adhesive polyimide/poly(ethylene terephthalate) compound film and a manufacturing method thereof are provided to enable the compound film to be used as a high quality adhesive film suitable for a flexible printed circuit board by virtue of improved heat-resistance, transparency, and mechanical properties thereof. CONSTITUTION: The high adhesive polyimide/poly(ethylene terephthalate) compound film comprises a thin soluble polyimide resin solution layer(1) coated on the one surface or the both surfaces of a poly(ethylene terephthalate) film(3), and a high adhesive polyester layer(2) between the film and the resin layer so as to increase an interfacial adhesive property therebetween.